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  • About Nan Ya PCB
    • Company Profile
      • Corporate Philosophy
      • Company Overview
      • Company Organization
      • Company Milestone
    • Awards and Certification
    • Office & Factory Locations
  • Sustainable Development
    • Nan Ya PCB's Commitment of Sustainable Development
    • Environmental Protection
      • Our Responsibility & ESH Policy
      • Green Program
      • Product Inspection and Governance
    • Work & Life in Nan Ya PCB
    • Procurement Policy
    • Social Welfare
    • Labor & Ethic
    • ESG Organization
    • Awards and Certification
    • ESG Report
  • Products Applications
    • PCB
      • Introduction & Application
      • PCB Development
    • IC Substrate
      • Flip Chip Substrate
      • Wire Bond Substrate
      • IC Development
  • Technology
    • PCB
      • PCB HLC Technology Roadmap
      • HDI Technology Roadmap
    • IC Substrate
      • ABF Substrate TechnologyRoadmap
      • PP Substrate TechnologyRoadmap
  • News
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  • Investor Relations
    • Ethical Corporate Management
    • Financials
    • Corporate Governance
      • Corporate Governance Organization
      • Board of Directors
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      • Corporate Governance Rules
      • The Operation of Internal Auditing
      • Risk Management
      • Information Safety Management
      • Intellectual Property Management
    • Shareholders Services
      • Shareholder Structure
      • Dividend History
      • Information of Shareholders' Meeting
      • Investor Contact
      • TSE Listed Company Information
    • FAQ
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  • Stakeholder Engagement