Flip Chip Substrate Introduction & Application

ProductOutlines

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The die is directly attached to the substrate which plays as the connection between the chip and PCB by using solder bumps rather than gold wires. By taking the advantage of substrates, the ability oflogic gate could fan out the most inputs to the other logic gate efficiently. Meanwhile, the different ways of packaging improve I/O ports on flip chipsubstrates, which would be the developing trend in the future.

Types of Package

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Product Applications

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Pin / LandGrid Array： Microprocessor
Ball Grid Array ： Graphic Microprocessor, Northbridge Chipset,High-end ASIC Chipset, Set-top Box Chipset