Wire Bond Substrate Introduction & Application

Product Outlines

By using gold wires to connect the chip and electricalpads from the substrate, the substrate is known as "Wire Bond Substrate".It plays the function as the buffer between the chip and PCB. By takingthe advantage of substrates, the ability of logic gate could fan out the mostinputs to the other logic gate efficiently.

Types of Package

Ball Grid Array (BGA)

Plastic BGA (PBGA)

Chip Scale Package (CSP)

Wire Bonding CSP

Flip Chip CSP (FC-CSP)

Window BGA

Product Applications

BGA： MCP, Southbridge Chipset,Communication, Networking
CSP ： Memory (DRAM, Flash), Portable Device, Handset, ConsumerElectronics, PC Peripheral Device