ABF Substrate Technology Roadmap
Products Roadmap/Development Schedule
| Process | Item | CurrentCapability | 2026 | 2027 H1 | |
|---|---|---|---|---|---|
| H1 | H2 | ||||
| Structure | Max. Layer Count | 11+N+11 | 24L | >24L | |
| Body Size(mm) | 7.8~140 | 140 | >150 | >150 | |
| Max. Thickness(µm) | 2,800 | 3,000 | 3,000 | >3,000 | |
| Min. Thickness(µm) | 400 | 400 | 400 | 400 | |
| Routing Density | Line Width/Space(µm) | 9/12 | 8/8 | 8/8 | 6/7 |
| Laser TH/Pad(µm) | 80/180 | 80/180 | 80/180 | 80/135 | |
| Blind via/Pad(µm) | 50/75 | 45/70 | 45/65 | 45/61 | |
| Mech. TH/Pad(µm) | 150/250 | 100/200 | 100/175 | 100/175 | |
| Solder Bump | Min Bump Pitch(µm) | 110 | 90 | 90 | 80 |
| Material | Core/PP | High Tg/Low CTE/Halogen Free/Low Dk,Df | |||
| Solder Mask | High Tg/Low CTE/High Stiffness/High Resolution | ||||
| Surface Finish | IT,ENEPIG,OSP | ||||
Green Material Set
| Category | Item | CurrentCapability | 2025 | 2026 | |
|---|---|---|---|---|---|
| H1 | H2 | ||||
| Material | Core | Resonac E700GR, E705G(X, LH) MGC HL832NSF HL832NSA |
E795G(X, LH) E795UC(X, LH) |
Ultra Low CTE Core (< 3ppm /℃) | |
| Plugging Ink | IR6P/ IR10FH | IR6P IR-10F IR15S3 IR15F6 |
Ultra Low CTE Material | ||
| Dielectric | GX13/GX92/GXT31 GZ41/GL102/GL103 NX04H | GL107 NQ08 QX03 |
Low Dk&Df/Low CTE Material | ||
| SR | SR7300 SR7400 SRFA SR1 |
SR7500 SRFN/SRFK |
New | ||
| Bumping | SAC305/SnCu0.7 | Plated Bump | |||