ABF Substrate TechnologyRoadmap


Products Roadmap/Development Schedule



Process Item CurrentCapability 2025 2026
H1 H2
Structure Layer Count 11/N/11 24L >24L
Body Size 7.8~118(mm) 85, 98, 118(mm) >120(mm) >140(mm)
Core Substrate Process Core Core Thickness 200µm↑ 200µm↑ 150µm
PTH PTH/Land MTH:150/250(µm) MTH:100/200(µm) MTH:100/175(µm)
LTH:80/180(µm) LTH:80/135(µm)
Line/Space (Subtractive) 35/35(µm) 20/20(µm) 15/15(µm)
Build-up Process Laser Via/Pad 50/75(µm) 45/70(µm) 45/65(µm) 45/61(µm)
Via Registration +/-12.5µm +/-12.5µm +/-10µm +/-8µm
Stack Via 5 Stacked Vias 6 Stacked Vias -
DFR Formation Line/Space 9/12(µm) 8/8(µm) 6/7(µm)
Solder Resist Process SR Thickness 21µm 15µm 10µm
Registration +/-12.5µm +/-10µm +/-8µm
SRO 70µm 55µm 50µm
Surface Finish Lead Application Immersion Tin
Lead Free
Application
Immersion Tin, ENEPIG, OSP
LGA Application ENEPIG
C4 Bump Formation Bump Pitch 110µm 90µm <90µm
Bump Height
(Coin Bump)
10~30(µm) 5~30(µm)
Bump Diameter
(Coin Bump)
25~130(µm) 25~120(µm) 25~90(µm) 25~70(µm)
New Material SAC305, SnCu0.7



Green Material Set



Category Item CurrentCapability 2025 2026
H1 H2
Material Core Resonac E700GR,
E705G(X, LH)
MGC
HL832NSF
HL832NSA
E795G(X, LH)
E795UC(X, LH)
Ultra Low CTE Core (< 3ppm /℃)
Plugging Ink IR6P/ IR10FH IR6P
IR-10F
IR15S3
IR15F6
Ultra Low CTE Material
Dielectric GX13/GX92/GXT31 GZ41/GL102/GL103 NX04H GL107
NQ08
QX03
Low Dk&Df/Low CTE Material
SR SR7300
SR7400
SRFA
SR1
SR7500
SRFN/SRFK
New
Bumping SAC305/SnCu0.7 Plated Bump