PCB Development

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In response tothe evolution inthe wafermanufacturingtechnology,there aregrowingrequirements inthehigh-density circuits,transmissionefficiency, andsignalsdisturbingresistance.Thus, the trendof circuit on HDI boards andRigid- flex boardswill tend to behigh densitystacked via,smaller via, andfinepitch solutions.

The applicationand types of HDIboards andRigid-flexboards will beincreasing, inorder to becomplied withthe features offutureelectronicproducts, whichare ultra thin,multi-functional,and low voltageconsuming.

The increasingenvironmentalawarenesspropelselectroniccomponents andtheir materialto be lead-freeand halogen- free, in orderto becomequalified greenproducts definedby RoHSlegislations.

With the rise of products such as automatic driving and AI, the requirements for material loss are getting lower and lower, so printed circuit board materials will develop in the direction of low loss high-frequency high-speed materials.