PCB HLC Technology Roadmap
Products Roadmap/Development Schedule
| Category | Item | CurrentCapability | By 2026 H2 | By 2027 H1 | By 2027 H2 | |
|---|---|---|---|---|---|---|
| Structure | Max. LayerCount | 28 | 34 | 36 | 40 | |
| Max.Sequential Lamination | 8+8 | 10+10 | 10+10 | 10+10 | ||
| Max.Thickness | 3.5 mm | 4.5 mm | 4.5 mm | 4.5 mm | ||
| VIPPO(POFV) | Min. plugging drilling hole size | 175 µm | 100 µm | 100 µm | 80 µm | |
| Max. plugging A/R (drilling size/ thickness) |
15.7 (4.0/0.254 mm) |
17.5 (3.5/0.2 mm) |
17.5 (3.5/0.2 mm) |
17.5 (3.5/0.2 mm) |
||
| Routing Density | Line Width/Space | 1oz Cu | 50/60 µm | 40/45 µm | 40/45 µm | 40/45 µm |
| 2oz Cu | 115/115 µm | 90/100 µm | 90/100 µm | 90/100 µm | ||
| Material | High Tg / Low CTE / Low Dk, Df / Halogen Free | |||||
| Surface Finish | OSP, ENIG, Hard gold, selective Ni/Au, selective Hard gold, Imm.Tin , Imm.Silver, ENEPIG | |||||