|
|
|
|
|
|
|
|
|
|
|
|
|
PCB HLC Technology Roadmap |
|
|
|
 Products Roadmap/
Development Schedule
 |
|
|
|
|
Category |
Item |
Current
Capability |
By 2024 H2 |
By 2025 H1 |
By 2025 H2 |
|
Structure |
Max. Layer
Count |
28 |
32 |
32 |
32 |
Max.
Sequential
Lamination |
8+8 |
10+10 |
10+10 |
10+10 |
|
Max.
Thickness |
3.2 mm |
3.6 mm |
3.6 mm |
3.8 mm |
|
VIPPO(POFV)
|
Min. plugging drilling hole size |
175 µm |
150 µm |
150 µm |
125 µm |
Max. plugging A/R
(drilling size/ thickness)
|
12.2
(0.250/3.05 mm)
|
14.4
(0.228/3.25 mm) |
14.4
(0.228/3.25 mm) |
15.2
(0.25/3.8 mm)
|
Routing
Density |
Line Width/Space |
1oz Cu |
50/60
µm |
45/50
µm |
40/50
µm |
40/50
µm |
|
2oz Cu |
115/115
µm |
100/100
µm |
100/100
µm |
90/100
µm |
|
Material |
High Tg, Low
CTE, Low Dk/Df, Halogen Free |
|
Surface Finish |
OSP, ENIG. Hard gold, selective Ni/Au, selective Hard gold, Imm.Tin, Imm.Silver, ENEPIG |
|
|
|
|
網站更新日期：
2024/7/1
|
|
|