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PCB HLC Technology Roadmap |
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Products Roadmap/
Development Schedule
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Category |
Item |
Current
Capability |
By 2025 H1 |
By 2025 H2 |
By 2026 H1 |
Structure |
Max. Layer
Count |
28 |
32 |
32 |
34 |
Max.
Sequential
Lamination |
8+8 |
10+10 |
10+10 |
10+10 |
Max.
Thickness |
3.2 mm |
3.6 mm |
3.6 mm |
3.6 mm |
VIPPO(POFV)
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Min. plugging drilling hole size |
175 µm |
150 µm |
125 µm |
100 µm |
Max. plugging A/R
(drilling size/ thickness)
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12.2 (0.250/3.05 mm)
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14.4 (0.228/3.25 mm) |
15.3 (0.228/3.5 mm) |
17 (0.2/3.5 mm)
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Routing
Density |
Line Width/Space |
1oz Cu |
50/60
µm |
40/50
µm |
40/50
µm |
40/45
µm |
2oz Cu |
115/115
µm |
100/100
µm |
90/100
µm |
90/100
µm |
Material |
High Tg / Low CTE / Low Dk, Df / Halogen Free |
Surface Finish |
OSP, ENIG, Hard gold, selective Ni/Au, selective Hard gold, Imm.Tin , Imm.Silver, ENEPIG |
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網站更新日期:
2024/9/19
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