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 首頁 > 技術專區 > PCB>  HDI Technology Roadmap
 
   
 
PCB
PCB HLC Technology
      Roadmap
 HDI Technology Roadmap
IC Substrate

   

    

HDI Technology Roadmap  
  Products Roadmap/ Development Schedule 
 
 
Category Item Current Capability By 2022 H1 By 2022 H2 By 2023 H1
Structure Stagger Via 6+N+6 6+N+6 7+N+7 7+N+7
Stacked Via 6+N+6 6+N+6 7+N+7 7+N+7
All Stacked Via 12 Layers 12 Layers 14 Layers 14 Layers
Routing
Density 
Line Width/Space 40/40 µm 35/35 µm 35/35 µm 30/30 µm
Laser Via/Pad 70/150 µm 70/150 µm 60/115 µm 60/100 µm
Router Tolerance +/-50 µm +/-50 µm +/-50 µm +/-50 µm
Material High Tg, Low CTE, Low Dk/Df, Halogen Free

 
  更新日期: 2022/06/22