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HDI Technology Roadmap |
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 Products Roadmap/
Development Schedule
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Category |
Item |
Current
Capability |
By 2024 H2 |
By 2025
H1
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By 2025 H2
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Structure |
Stagger Via |
7+N+7 |
8+N+8 |
9+N+9 |
9+N+9 |
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Stacked Via |
7+N+7 |
8+N+8 |
9+N+9 |
9+N+9 |
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All Stacked
Via |
16 Layers |
18
Layers |
20 Layers |
20 Layers |
| Board Thickness |
Min. core thickness |
50 µm |
40 µm |
40 µm |
40 µm |
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Max. prepreg thickness |
30 µm
(1017 series) |
25 µm
(1010 series)
|
25 µm
(1010 series) |
25 µm
(1010 series) |
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Line Width/Space |
35/35
µm |
25/25
µm |
20/25
µm |
20/20
µm |
Routing
Density |
Laser Via/Pad |
70/130
µm |
65/120
µm |
65/110
µm |
60/100
µm |
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Router
Tolerance |
+/-50
µm |
+/-50
µm |
+/-50
µm |
+/-50
µm |
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Cavity |
Depth Tolerance Capability |
+/-75 µm |
+/-50 µm |
+/-35 µm |
+/-35 µm |
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Material |
High Tg, Low
CTE, Low Dk/Df, Halogen Free |
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Surface Finish |
OSP, ENIG. Hard gold, selective Ni/Au, selective Hard gold, Imm.Tin, Imm.Silver, ENEPIG |
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網站更新日期：
2024/3/28
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