Nan Ya PCB Corporation


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Home > Technology > PCB> Standard PCB Technology Roadmap

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PCB HLC Technology Roadmap

Products Roadmap/ Development Schedule

Category	Item		Current Capability	By 2025 H1	By 2025 H2	By 2026 H1
Structure	Max. Layer Count		28	32	32	34
	Max. Sequential Lamination		8+8	10+10	10+10	10+10
	Max. Thickness		3.2 mm	3.6 mm	3.6 mm	3.6 mm
VIPPO(POFV)	Min. plugging drilling hole size		175 µm	150 µm	125 µm	100 µm
VIPPO(POFV)	Max. plugging A/R (drilling size/ thickness)		12.2 (0.250/3.05 mm)	14.4 (0.228/3.25 mm)	15.3 (0.228/3.5 mm)	17 (0.2/3.5 mm)
Routing Density	Line Width/Space	1oz Cu	50/60 µm	40/50 µm	40/50 µm	40/45 µm
Routing Density	Line Width/Space	2oz Cu	115/115 µm	100/100 µm	90/100 µm	90/100 µm
Material			High Tg / Low CTE / Low Dk, Df / Halogen Free
Surface Finish			OSP, ENIG, Hard gold, selective Ni/Au, selective Hard gold, Imm.Tin , Imm.Silver, ENEPIG

WEB Updated Date: 2024/9/19