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PCB HLC Technology Roadmap |
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 Products Roadmap/
Development Schedule
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Category |
Item |
Current
Capability |
By 2021 H2 |
By 2022 H1 |
By 2022 H2 |
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Structure |
Max. Layer
Count |
24 |
30 |
32 |
32 |
Max.
Sequential
Lamination |
8+8 |
8+8 |
10+10 |
10+10 |
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Max.
Thickness |
3.2 mm |
3.4 mm |
3.6 mm |
3.6 mm |
Routing
Density |
Line Width/Space |
1oz Cu |
60/60
µm |
60/60
µm |
55/55
µm |
55/55
µm |
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2oz Cu |
115/115
µm |
115/115
µm |
100/100
µm |
100/100
µm |
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Material |
High Tg, Low
CTE, Low Dk/Df, Halogen Free |
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Updated Date:
2022/06/22
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