Nan Ya PCB Corporation


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Home > Technology > IC Substrate > PP Substrate Technology Roadmap

	PCB

	IC Substrate
	ABF Substrate Technology Roadmap PP Substrate Technology Roadmap

PP Substrate Technology Roadmap

Products Roadmap/ Development Schedule

Category	Item		Current Capability	By 2024 H2	By 2025 H1	By 2025 H2
Structure	Max. Layer Count		7+2+7	7+2+7	7+2+7	7+2+7
	Max. Thickness		1350 um	1350 um	1350 um	1350 um
	Min. Thickness		80 um	80 um	80 um	80 um
Routing Density	Line Width/ Space		8/10 um	6/8 um	5/5 um	5/5 um
	Laser TH/ Pad		65/105 um	60/100 um	60/100 um	60/100 um
	Blind via/ Pad		60/90 um	55/85 um	50/80 um	45/75 um
	Mech. TH/ Pad		75/175 um	75/175 um	75/175 um	75/175 um
	Router Capability	Laser	+/-25 um	+/-25 um	+/-25 um	+/-25 um
	Router Capability	Mech.	+/-50 um	+/-50 um	+/-50 um	+/-50 um
Solder Bump	Min. Bump Pitch		130 um	130 um	110 um	110 um
Material	Core / PP		High Tg / Low CTE / Halogen Free/Low Dk, Df
	Solder Mask		High Tg / Low CTE / High Stiffness / High Resolution
	Surface Finish		Soft Ni/Au , ENIG , ENEPIG , OSP

WEB Updated Date: 2024/3/28