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Home > Products & Applications > IC Substrate> Wire Bond Substrate Introduction & Application

	PCB

	IC Substrate
		Flip Chip Substrate
		Wire Bond Substrate
		Development

Wire Bond Substrate Introduction & Application

Product Outlines

By using gold wires to connect the chip and electrical pads from the substrate, the substrate is known as "Wire Bond Substrate". It plays the function as the buffer between the chip and PCB. By taking the advantage of substrates, the ability of logic gate could fan out the most inputs to the other logic gate efficiently.

Types of Package

Ball Grid Array (BGA)

Plastic BGA (PBGA)

Chip Scale Package (CSP)


Wire Bonding CSP	Flip Chip CSP (FC-CSP)	Window BGA

Product Applications

BGA：	MCP, Southbridge Chipset,Communication, Networking
CSP：	Memory (DRAM, Flash), Portable Device, Handset, Consumer Electronics, PC Peripheral Device

WEB Updated Date: 2024/5/11