Nan Ya PCB Corporation

	In response to the evolution in the wafer manufacturing technology, there are growing requirements in the high-density circuits, transmission efficiency, and signals disturbing resistance. Thus, the trend of circuit on HDI boards and Rigid- flex boards will tend to be high density stacked via, smaller via, and fine pitch solutions.
	The application and types of HDI boards and Rigid-flex boards will be increasing, in order to be complied with the features of future electronic products, which are ultra thin, multi-functional, and low voltage consuming.
	The increasing environmental awareness propels electronic components and their material to be lead-free and halogen- free, in order to become qualified green products defined by RoHS legislations.
	With the rise of products such as automatic driving and AI, the requirements for material loss are getting lower and lower, so printed circuit board materials will develop in the direction of low loss high-frequency high-speed materials.