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Home > Products & Applications > IC Substrate> Flip Chip Substrate Introduction & Application

	PCB

	IC Substrate
		Flip Chip Substrate
		Wire Bond Substrate
		Development

Flip Chip Substrate Introduction & Application

Product Outlines

The die is directly attached to the substrate which plays as the connection between the chip and PCB by using solder bumps rather than gold wires. By taking the advantage of substrates, the ability of logic gate could fan out the most inputs to the other logic gate efficiently. Meanwhile, the different ways of packaging improve I/O ports on flip chip substrates, which would be the developing trend in the future.

Types of Package


Pin Grid Array (PGA)	Land Grid Array (LGA)	Ball Grid Array (BGA)

Product Applications

Pin / Land Grid Array	：	Microprocessor
Ball Grid Array	：	Graphic Microprocessor, Northbridge Chipset, High-end ASIC Chipset, Set-top Box Chipset

WEB Updated Date: 2024/4/9