PP Substrate Technology Roadmap


Products Roadmap/Development Schedule



Process Item CurrentCapability 2025 H2 2026 H1 2026 H2
Structure Max. LayerCount 7+2+7 8+2+8 8+2+8 8+2+8
Max. Thickness 1350 µm 1350 µm 1500 µm 1500 µm
Min. Thickness 80 µm 80 µm 70 µm 70 µm
Routing Density Line Width/ Space 8/10 µm 5/5 µm 5/5 µm 5/5 µm
Laser TH/ Pad 60/100 µm 60/90 µm 55/85 µm 55/85 µm
Blind via/ Pad 60/90 µm 45/75 µm 40/70 µm 40/65 µm
Mech. TH/ Pad 75/175 µm 75/175 µm 75/175 µm 75/175 µm
Router Capability Laser +/-25 µm +/-20 µm +/-20 µm +/-20 µm
Mech. +/-50 µm +/-50 µm +/-50 µm +/-50 µm
Solder Bump Min. Bump Pitch 130 µm 110 µm 90 µm 90 µm
Material Core / PP High Tg / Low CTE/ Halogen Free/Low Dk, Df
Solder Mask High Tg / Low CTE/ High Stiffness / HighResolution
Surface Finish Soft Ni/Au , ENIG, ENEPIG , OSP