Structure |
Max. LayerCount |
7+2+7 |
8+2+8 |
8+2+8 |
8+2+8 |
Max. Thickness |
1350 µm |
1350 µm |
1500 µm |
1500 µm |
Min. Thickness |
80 µm |
80 µm |
70 µm |
70 µm |
Routing Density |
Line Width/ Space |
8/10 µm |
5/5 µm |
5/5 µm |
5/5 µm |
Laser TH/ Pad |
60/100 µm |
60/90 µm |
55/85 µm |
55/85 µm |
Blind via/ Pad |
60/90 µm |
45/75 µm |
40/70 µm |
40/65 µm |
Mech. TH/ Pad |
75/175 µm |
75/175 µm |
75/175 µm |
75/175 µm |
Router Capability |
Laser |
+/-25 µm |
+/-20 µm |
+/-20 µm |
+/-20 µm |
Mech. |
+/-50 µm |
+/-50 µm |
+/-50 µm |
+/-50 µm |
Solder Bump |
Min. Bump Pitch |
130 µm |
110 µm |
90 µm |
90 µm |
Material |
Core / PP |
High Tg / Low CTE/ Halogen Free/Low Dk, Df |
Solder Mask |
High Tg / Low CTE/ High Stiffness / HighResolution |
Surface Finish |
Soft Ni/Au , ENIG, ENEPIG , OSP |