| Structure |
Max. LayerCount |
7+2+7 |
8+2+8 |
8+2+8 |
8+2+8 |
| Max. Thickness |
1350 µm |
1350 µm |
1500 µm |
1500 µm |
| Min. Thickness |
80 µm |
80 µm |
70 µm |
70 µm |
| Routing Density |
Line Width/ Space |
8/10 µm |
5/5 µm |
5/5 µm |
5/5 µm |
| Laser TH/ Pad |
60/100 µm |
60/90 µm |
55/85 µm |
55/85 µm |
| Blind via/ Pad |
55/85 µm |
45/75 µm |
40/70 µm |
40/65 µm |
| Mech. TH/ Pad |
75/175 µm |
75/175 µm |
75/175 µm |
75/175 µm |
| Router Capability |
Laser |
+/-25 µm |
+/-20 µm |
+/-20 µm |
+/-20 µm |
| Mech. |
+/-50 µm |
+/-50 µm |
+/-50 µm |
+/-50 µm |
| Solder Bump |
Min. Bump Pitch |
128 µm |
110 µm |
90 µm |
90 µm |
| Material |
Core / PP |
High Tg / Low CTE/ Halogen Free/Low Dk, Df |
| Solder Mask |
High Tg / Low CTE/ High Stiffness / HighResolution |
| Surface Finish |
Soft Ni/Au , ENIG, ENEPIG , OSP |
PP Substrate Technology Roadmap
Products Roadmap/Development Schedule