HDI Technology Roadmap
Products Roadmap/Development Schedule
| Category | Item | CurrentCapability | By 2025 H2 | By 2026 H1 | By 2026 H2 | |
|---|---|---|---|---|---|---|
| Structure | Stagger Via | 7+N+7 | 9+N+9 | 9+N+9 | 9+N+9 | |
| Stacked Via | 7+N+7 | 9+N+9 | 9+N+9 | 9+N+9 | ||
| All StackedVia | 16Layers | 20Layers | 20Layers | 20Layers | ||
| Board Thickness | Min. core thickness | 50 µm | 40 µm | 40 µm | 40 µm | |
| Max. prepreg thickness |
30 µm (1017 series) |
25 µm (1010 series) |
25 µm (1010 series) |
25 µm (1010 series) |
||
| Line Width/Space | 35/35 µm | 30/35 µm | 30/30 µm | 25/30 µm | ||
| Routing Density | Laser Via/Pad | 70/130 µm | 65/110 µm | 60/110 µm | 60/110 µm | |
| RouterTolerance | +/-50 µm | +/-50 µm | +/-50 µm | +/-50 µm | ||
| Cavity | Depth Tolerance Capability | +/-75 µm | +/-35 µm | +/-30 µm | +/-30 µm | |
| Material | High Tg / Low CTE / Low Dk, Df / Halogen Free | |||||
| Surface Finish | OSP, ENIG, Hard gold, selective Ni/Au, selective Hard gold, Imm.Tin , Imm.Silver, ENEPIG | |||||