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Wire
Bond Substrate Technology Roadmap |
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| Category
|
Item |
Current
capability
(units: um) |
By
2011Q4 |
By 2012H1 |
By 2012H2 |
| Material |
Core |
HL832NS/NXA/ E679FGB/ DS 7409HGBL /HGBLE / Sumitomo 4785GSB/THG
|
HL832NS(LC) E700G DS 7409HGBX |
Sumitomo 9979
|
- |
| Solder mask |
AUS5,AUS303, AUS308, AUS320, AUS410 |
AUS SR1 |
New film type SR
|
- |
| Thickness |
2L/ Core |
120/50 |
100/40 |
- |
90/35 |
| 4L/ Core/ PP |
210/50/35 |
200/40/30 |
180/40/30
|
170/35/25 |
Routing
density
|
Line/ Space |
20/20 |
20/20 |
20/20 |
15/15 |
| BF pitch/ Width |
70/35 |
70/35 |
65/35 |
60/30 |
| C4 pitch |
150 |
140 |
- |
130 |
| Ball pitch |
350 |
325 |
300 |
275 |
| Laser/ Pad |
70/130 |
65/125 |
65/105 |
65/95 |
| Mech./ Pad |
100/200 |
75/175 |
75/160 |
- |
| SRO |
75 |
70 |
65 |
60 |
| Structure |
Special structure |
2L, 4L, 1-2-1, 6L, 1-4-1, 2-2-2, 1-2-2-1, 8L 3-2-3
Built-up+ Stacked via,
(core 60um)
|
10L, 4-2-4 |
Embedded Coreless
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4L Embedded |
| Surface finish |
PBGA/WB-CSP |
Ni/Au, Selective Ni/Au, ENEPIG, OSP, AFOP,
Etch-Back, Tailess |
- |
- |
- |
| FC-CSP |
ENIG, ENEPIG, IT, OSP, AFOP |
- |
- |
- |
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Update Date:
2011/12/27
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