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Wire Bond Substrate
Technology Roadmap |
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| Category
|
Item |
Current
capability
(units: um) |
By 2013 H1 |
By 2013 H2 |
By 2014 |
| Material |
Core |
HL832NX-A/ E679FGB/
DS-7409HGBLE/HGBS/
Smitomo4785GS-B/TH-GP500LC |
HL832NS(LC)/E700G
DS/7409HGBX |
HL832NSF-LCA/E705G/E805G
/Sumitomo THJ
|
- |
| Solder mask |
AUS5,AUS303, AUS308, AUS320,
AUS410 |
AUS SR1 |
AUS SR2 |
- |
| Thickness |
2L/ Core |
120/50 |
100/40 |
- |
90/35 |
| 4L/ Core/ PP |
210/50/35 |
200/40/30 |
180/40/30
|
170/35/25 |
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6L/Core/PP |
360/60/35 |
300/50/35 |
280/40/30 |
260/35/25 |
Routing
density
|
Line/ Space |
20/20 |
20/20
|
15/15 |
12/12 |
| BF pitch/ Width |
70/35 |
70/35 |
65/35 |
60/30 |
| C4 pitch |
150 |
140 |
130 |
120 |
| Ball pitch |
350 |
325 |
300 |
275 |
| Laser/ Pad |
70/130 |
65/125 |
65/105 |
65/95 |
| Mech./ Pad |
100/200 |
75/175 |
75/160 |
75/150 |
| SRO |
75 |
70 |
65 |
60 |
| Structure |
Special structure |
2L, 4L,
1-2-1, 6L, 1-4-1, 2-2-2,
1-2-2-1,8L 3-2-3 Built-up+
Stacked via |
10L, 4-2-4 |
Embedded Coreless
|
4L
Embedded |
| Surface finish |
PBGA/WB-CSP |
Ni/Au, Selective Ni/Au, ENEPIG, OSP, AFOP,
Etch-Back, Tailess |
- |
- |
Thin Ni
ENEPIG |
| FC-CSP |
ENIG, ENEPIG, IT, OSP, AFOP |
- |
- |
- |
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Update Date:102/4/1 |
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