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 Home > Technology > PCB>  Standard PCB Technology Roadmap
 
   
PCB
PCB HLC Technology
      Roadmap
 HDI Technology Roadmap
IC Substrate

     

    

PCB HLC Technology Roadmap

Products Roadmap/ Development Schedule
 

Category Item Current Capability By 2014 H2 By 2015 H1 By 2015 H2
Structure   Max. Layer Count 24 24 28 30
Max. Sequential
Lamination
8+8 8+8 14+14 12+12+12
Max. Thickness 130 mil 130 mil 140 mil 140 mil
Max. Aspect Ratio
(10 mil Drill Size) 
12 12 13 14
Max. Plugging Hole
Aspect Ratio
(10 mil Drill Size)
7 7 10 12
Routing
Density 
Line Width/Space 1oz Cu 3.5/3.5 mil 3.0/3.5 mil 3.0/3.0 mil 3.0/3.0 mil
2oz Cu 4.0/5.0 mil 4.0/5.0 mil 3.5/4.5 mil 3.5/4.5 mil
Registration
22-28 Layers
Outer Drill Size+8.2 mil Drill Size+8.2 mil Drill Size+7.7 mil Drill Size+7.2 mil
Inner Drill Size+9.2 mil Drill Size+9.2 mil Drill Size+8.7 mil Drill sSize+8.7 mil
Min. Drill  8.4 mil 8.4 mil 8 mil 8 mil
to Metal
Back Drill Depth  +/-5 mil +/-5 mil +/-4 mil +/-4 mil
Accuracy Tolerance
Material High Tg FR4 NPGN170, NP175F, Isola 370HR
Low Dk/Df IT-150DA, NPLD II, HE679G, NPLDIII, Megtron 4
Surface Finish Ni/Au, Selective Ni/Au, ENEPIG, OSP, Immersion Tin, Immersion Ag

Updated Date: 2014/1/1