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 Home > Technology > PCB>  Standard PCB Technology Roadmap
 
   
PCB
PCB HLC Technology
      Roadmap
 HDI Technology Roadmap
IC Substrate

     

    

PCB HLC Technology Roadmap

Products Roadmap/ Development Schedule
 

Category Item Current Capability By 2017 H1 By 2017 H2 By 2018 H1
Structure   Max. Layer Count 24 28 28 32
Max. Sequential
Lamination
8+8 8+8 10+10 10+10
Max. Thickness 3.2 mm 3.2 mm 3.4 mm 3.4 mm
Max. Aspect Ratio
(250 µm Drill Size) 
12.8 12.8 13.6 13.6
Max. Plugging Hole
Aspect Ratio
(250 µm Drill Size)
9.6 9.6 11.6 11.6
Routing
Density 
Line Width/Space 1oz Cu 75/75 µm 60/60 µm 55/55 µm 55/55 µm
2oz Cu 125/125 µm 115/115 µm 100/100 µm 100/100 µm
Registration
22-28 Layers
Outer Drill Size+210 µm Drill Size+210 µm Drill Size+195 µm Drill Size+185 µm
Inner Drill Size+235 µm Drill Size+235 µm Drill Size+220 µm Drill Size+220 µm
Min. Drill
to Metal 
215 µm 215 µm 205 µm 205 µm
Back Drill Depth 
Accuracy Tolerance
+/-115 µm +/-100 µm +/-100 µm +/-90 µm
Material High Tg FR4 NPGN170, NP175F, Isola 370HR
Low Dk/Df IT-150DA, NP175FM, NPLD II, HE679G, NPG170D, NPG171,
Megtron 4, RO 4350, TU862HF
Surface Finish Ni/Au, Selective Ni/Au, OSP, Immersion Tin, Immersion Ag, LF HASL

Updated Date: 2016/11/1