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 Home > Technology > PCB>  Standard PCB Technology Roadmap
 
   
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 Standard PCB Technology Roadmap

Item

Current Capability

2013 2014

Q1

Q2

Q3

Q4

Q1

Q2

Layer count &thickness, size Maximum working panel size 18x24 inch 18x24 inch
Range of layer count 2~26 layers 2~28 layers 2~30 layers
Maximum thickness 130 mil 140 mil 140 mil
Maximum thickness(6 layers) 12 mil 11 mil 11 mil 10 mil
Line/space capability Line/space(1.2 mil Cu thickness) 2/2 mil 1.6/1.6 mil 1.6/1.6 mil 1.2 mil
Line/space(0.8 mil Cu thickness) 2/2 mil 1.6/1.6 mil 1.6/1.6 mil 1.2 mil
Line/space(2 oz) 5/5 mil 5/5 mil
Line/space(3 oz) 8/8 mil 8/8 mil
Line/space(5 oz) 12/12 mil 12/12 mil
S/M process Registration  1.4 mil for server 0.8 mil
 1.2 mil for HDI
 0.8 mil for module
Solder dam minimum width 2.5 mil 2.5 mil 2 mil
Black S/M minimum dam width 3.5 mil 3.5 mil 3 mil
S/M Opening size 4 mil 4 mil
Impedance tolerance Single ended (50 ohm) +/-10% +/-8% +/-6%
Differential pair(100 ohm) +/-15% +/-10% +/-8%
Routing
Outline to metal tolerance
2 mil 2 mil
Depth control accuracy +/-2 mil

+/-2 mil

Mechanical drilling Smallest drilling hole size
(PCB thickness)

8 mil (62 mil)
4 mil (4 mil)

6 mil (40 mil) 6 mil/(40 mil thickness)
3mil/(1.6 mil core)
Smallest plated hole size
(PCB thickness)
6 mil (62 mil)
2.5 mil (4 mil)
4 mil (40 mil) 6 mil/(40 mil thickness)
3mil/(1.6 mil core)
Aspect ratio (drilling hole size/PCB thickness) 10.8 mil
(12/130)
12.6 mil
(10/126)
13.5 mil
(10/135)
Internal/external via pad (8~12 layers, 8 mil drilling) 16 mil 14 mil 12 mil
Anti-pad size (8~12 layers,8 mil drilling size) 20 mil 19 mil 18 mil
Internal/external via pad (12~26 layers, 10 mil drilling) 19 mil 18 mil 16 mil
Anti-pad size (12~26 layers, 10 mil drilling) 24 mil 23 mil 21 mil
Back drilling depth accuracy tolerance +/-5 mil +/-5 mil 4 mil
VIPPPO aspect ratio
(drilling hole size/PCB thickness)
7 mil (12/84) 10 mil (12/120) 12.6 mil
(10/126)

Update Date:2013/4/1