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 Home> Technology > PCB>  Rigid-Flex Technology Roadmap
 
   
PCB
PCB HLC Technology
      Roadmap
 HDI Technology Roadmap
IC Substrate

Rigid-Flex Technology Roadmap
 

Item

Current Capability

2013 2014
Q1 Q2 Q3 Q4 Q1 Q2
Structure Rigid-flex symmetric structure N-2-N
N-3-N
N-4-N
N-2-N
N-3-N
N-4-N
Rigid-flex with flying tail (asymmetrical structure) N-2 N-2
Rigid-flex HDI structure 3+N+3 3+N+3
Material thickness & resin flow FCCL thickness 1~3 mil 1~3 mil
Minimum core layer  thickness (PI & adhesion) 1.1 mil
(0.5 mil+0.6 mil)
1.1 mil
Maximum stiffener thickness (PI & adhesion) 6 mil
(5 mil+1 mil)
6 mil
Minimum low flow PP thickness 1.6 mil 1.6 mil 1.2 mil
LF PP squeeze out 20 mil 20 mil 16 mil
Via on FCCL Minimum mechanical drilling size 4 mil 4 mil
Minimum laser drilling size 4 mil 4 mil 3 mil
Line/space Line/space on FCCL 2.4/2.4 mil 2.4/2.4 mil 2 mil
Registration Traditional CVL registration +/-8 mil 8 mil
Photo-imageable ink +/-2 mil +/-2 mil
Router Router tolerance (flex area) +/-2.4mil 2.4 mil 2 mil

Updated Date:2014/1/1