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 Home > Technology > IC Substrate> Rigid-Flex Technology Roadmap
 
   
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Standard PCB Technology
     Roadmap
HDI Technology Roadmap
Rigid-Flex Technology
     Roadmap

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IC Substrate

Rigid-Flex Technology Roadmap
 

Item

Current capability

2011 2012
Q3 Q4 Q1 Q2 Q3 Q4
Structure Rigid-Flex symmetric structure N-2-N
N-3-N
N-4-N
N-2-N
N-3-N
N-4-N
Rigid-Flex with flying tail(asymmetrical structure) N-2 N-2
Rigid Flex HDI structure 2+N+2 2+N+2 2+N+2(stacked via)
Material thickness & resin flow FCCL Thickness 1~3 mil 1~3 mil
Minimum Coyerlay thickness(PI& adhesion) 1.1 mil 1.1 mil
Maximum Stffner thickness(PI& adhesion) 6 mil 6 mil
Minimum low flow pp thickness 1.6 mil 1.1 mil
LF PP squeeze out 28 mil 28 mil 28 mil
Via on FCCL Minimum mechanical drilling size 4 mil 4 mil
Minimum laser drilling size 4 mil 4 mil 3 mil
Line/space Line/space on FCCL 3/3 mil 2/2 mil
Registration Traditional CVL registration +/-8 mil 8 mil
Photo-Imageable Ink +/-2 mil +/-2 mil
Router Router tolerance +/-2.4mil 2.4 mil 2 mil

Update Date: 2011/12/27