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 Home > Technology > IC Substrate >   PP Substrate Technology Roadmap
 
   
PCB
IC Substrate 

ABF Substrate   
     Technology Roadmap 
   
PP Substrate  
     Technology Roadmap 
 

 

PP Substrate Technology Roadmap
 

Products Roadmap/ Development Schedule 
 
Category Item Current Capability By 2019 H2 By 2020 H1 By 2020 H2
Structure  Total Thickness 2L 85 µm 80 µm 70 µm 70 µm
3L 90 µm 80 µm 80 µm 70 µm
Routing
Density
Line/Space 15/15 µm 12/12 µm 10/10 µm 8/8 µm
Laser TH/Pad 75/150 µm 65/140 µm 60/120 µm 60/110 µm
Blind Via/Pad 65/110 µm 60/100 µm 60/100 µm 55/90 µm
Mech. TH/Pad 75/175 µm 75/150 µm 65/145 µm 65/135 µm
Material Material  High Tg, Low CTE, Low Dk/Df, Halogen Free
Solder Mask High Tg, Low CTE, High Stiffness

Updated Date: 2018/12/31