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PCB Material
Technology Roadmap |
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| Item |
Current
Capability
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2013 |
2014 |
| Q1 |
Q2 |
Q3 |
Q4 |
Q1
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Q2
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| Copper
|
Range of copper weight
|
1/9~3 oz
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1/9~4 oz
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| Metal core
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6~12 oz
|
6~12 oz
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| Thickness |
Core thickness range |
1.6~47 mil |
1.2~47 mil |
1.0~47 mil |
| PP thickness range |
1.2~8 mil |
1.2~8 mil |
1.0~8 mil |
| Surface finish |
．Immersion silver．ENIG．Selective
Ni/Au．Hard Au ．OSP
．Immersion tin．ENEPIG．Carbon printing．Lead free HASL
．Electrolytic soft Au |
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Non Halogen-Free |
Halogen Free |
| Material |
Rigid PCB material |
Normal
DF |
NP155F,
NP175F, NP180, NPRCC FR370HR
|
NPG-150,
NPG-170,
Hitachi E700
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| Low DF |
Rogers4350,
IS415, FR408,
Getek
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IT-150DA, FR408HR,
NPLDII
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Hitachi LZ71G, HE679G,
NPG170(D)
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| S/M material |
Taiyo PSR4000 series
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Tamura DS330
Taiyo BL-02
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| Plugging hole
material |
None
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Taiyo THP100-DRT,
Nanya SP-08,
HS-930, Sanei iR6
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| Heat
dissipation material |
Doosan DS500,
NPN 150F
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None |
| Flex
PCB material |
None
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NPGLF
UBE |
| EMI shielding
material |
None
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Toyobo: DW-250
Tasuta: SF-PC5000 |
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Update Date:
2013/4/1 |
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