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 Home > Technology > PCB> PCB Material Technology Roadmap
 
   
PCB
Standard PCB Technology
     Roadmap
HDI Technology Roadmap
Rigid-Flex Technology
     Roadmap

PCB Material Technology
     Roadmap
IC Substrate

PCB Material Technology Roadmap

Item

Current capability

2011 2012
Q3 Q4 Q1 Q2

Q3

Q4

Copper Range of available copper weight (UL approved)
1/4~5oz
1/4~5oz
Metal core 6~12oz 6~12 oz
Thickness Core thickness range 1.6~47mil 1.6~47mil 1.2~47mil
PP thickness range 1.2~8mil 1.2~8mil
 Surface finish .Immersion sliver.ENIG.Selective Ni/Au.Hard Au .OSP
.Immersion Tin.ENEPIG.Carbon printing.Lead free HASL

Non Halogen-Free Halogen Free
Material Rigid PCB material Normal Df

NP140,155,170,175,180,RCC Poly clad:FR406, 370HR

NPG-150,170, 180, RCC, NPGN-150,170

Low Df

Rogers4350, 4403, FR408, IS415

NPLDII

Hitachi LZ71G, HE679G

S/M material

Taiyo PSR4000 series
San-Ei 6000S

Tamura DS330
Taiyo BL-02

Plugging hole material

Taiyo S702K

Taiyo THP100-DRT
Nanya SP-08

Heat dissipation material

Doosan DS500

NPN-150F
Flex PCB material

None

NPGLF
UBE
FR4 Flexible material

NP-170SF

NP-170SF
EMI shielding material

None

Toyobo: DW-250
Tasuta: SF-PC5000

Update Date: 2011/12/27