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 Home > Technology > PCB>  PCB Material Technology Roadmap
 
   
PCB
PCB HLC Technology
      Roadmap
 HDI Technology Roadmap
IC Substrate

PCB Material Technology Roadmap

Item

Current Capability

2013 2014
Q1 Q2 Q3 Q4

Q1

Q2

Copper Range of copper weight
1/9~3 oz
1/9~4 oz
Metal core 6~12 oz 6~12 oz
Thickness Core thickness range 1.6~47 mil 1.2~47 mil 1.0~47 mil
PP thickness range 1.2~8 mil 1.2~8 mil 1.0~8 mil
 Surface finish .Immersion silver.ENIG.Selective Ni/Au.Hard Au .OSP
.Immersion tin.ENEPIG.Carbon printing.Lead free HASL .Electrolytic soft Au

Non Halogen-Free Halogen Free
Material Rigid PCB material Normal DF

NP155F, NP175F, NP180, NPRCC FR370HR

NPG-150,
NPG-170,
Hitachi E700

Low DF

Rogers4350, IS415, FR408, Getek

IT-150DA, FR408HR, NPLDII

Hitachi LZ71G, HE679G, NPG170(D)

S/M material

Taiyo PSR4000 series

Tamura DS330
Taiyo BL-02

Plugging hole material

None

Taiyo THP100-DRT, Nanya SP-08,
HS-930, Sanei iR6

Heat dissipation material

Doosan DS500, NPN 150F

None
Flex PCB material

None

NPGLF
UBE
EMI shielding material

None

Toyobo: DW-250
Tasuta: SF-PC5000

Updated Date: 2014/1/1