Item	Current capability		2011		2012
			Q3	Q4	Q1	Q2	Q3	Q4
Structure	HDI stagger via	5+N+5	5+N+5				6+N+6
	HDI stacked via	5 stacked	5 stacked				6 stacked
	HDI all stacked via	12 layers	12 layers
Laser via	Standard via  finished  hole size	3 mil	3 mil				2.4 mil
	Standard via capture/target pad	6 mil	6 mil				4.3 mil
	Skip via finished hole size	8 mil	8 mil
	Skip via anti pad	22 mil	22 mil
	Skip via capture/target pad	16 mil	16 mil
	Step via finished hole size	8 mil	8 mil
	Step via 2nd layer pad	16 mil	16 mil
	Step via capture/target pad	16 mil	16 mil
	Laser via aspect ratio (drilling size/thickness)	0.75 mil	0.75 mil
	Copper filled dimple size	0.6 mil	0.6 mil
	Laser drilling method	DLD	Direct laser drill
	BGA pitch	0.2 mm	0.2 mm
Embedded	Embedded passives	Sample	Sample				SVM