|
Item
|
Current
Capability
|
2013 |
2014
|
|
Q1 |
Q2 |
Q3 |
Q4 |
Q1 |
Q2 |
|
Structure
|
HDI stagger via
|
4+N+4 |
5+N+5 |
| HDI stacked via
|
4 stacked |
5 stacked
|
| HDI all stacked via
|
10 layers |
12 layers |
12 layers |
14 layers |
|
Laser via
|
Minimum via
drill hole size
(dielectric thickness)
|
3 mil
(1.8 mil↓) |
2.5 mil
(1.2 mil↓) |
2.5 mil
(1.2 mil) |
2 mil
(1.0 mil) |
|
Minimum laser via
capture/target pad
|
6 mil |
4.5 mil |
4.5 mil |
4 mil |
|
Skip
via drilling hole size
|
8~12 mil |
8~12 mil |
| Skip via anti-pad
|
22 mil |
22 mil |
| Skip via capture/target pad
|
15~19 mil
dr+7 mil |
15 mil
dr+7 mil |
| Laser via aspect
ratio (drilling size/thickness) |
0.75 mil |
0.75 mil |
|
Cooper filled
dimple depth |
0.6 mil |
0.6 mil |
|
Resin
filled via size |
Maximum 12 mil |
Maximum 12 mil |
|
Cooper filled
in through hole |
Maximum 4 mil
core |
6 mil |
8 mil |
| BGA
ball pitch |
0.2 mm |
0.2 mm |
|
Embedded |
Embedded passives |
Study |
Sample |
SVM |