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Flip Chip Substrate Technology
Roadmap |
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 Products Roadmap/
Development Schedule
| Process |
Item |
Development
Schedule |
| 2013 |
2014 |
| Q1 |
Q2 |
Q3 |
Q4 |
Q1 |
Q2 |
Q3 |
Q4 |
| Core
substrate process |
Core |
Core
thickness |
0.2 mm↑ |
0.1 mm↑ |
| PTH
drill |
Through
pitch |
250 (um) |
210 (um) |
| Through
diameter |
100 (um) |
80 (um) |
| DES |
Line/space |
35/35 (um) |
25/25 (um)_MSAP |
| Build-up process |
Laser |
Via/pad |
60/90 (um) |
55/70 (um) |
| Via
registration |
15 (um) |
12.5 (um) |
| Stack
via |
4 stacked vias |
5 stacked vias |
| DFR formation |
Line/space |
9/12 (um) |
8/8 (um) |
| Solder
resist process |
SR |
Thickness |
21 (um) |
18 (um) |
| Tolerance |
+/-7.5 (um) |
+/-5 (um) |
| Registration |
+/-12.5 (um) |
+/-10 (um) |
| SRO |
70 (um) |
65 (um) |
| Surface
finish |
Lead
application |
Immersion
tin HVM |
| ENIG HVM |
| Lead
free application |
Immersion
tin HVM |
| ENEPIG HVM
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OSP HVM |
| LGA
application |
ENAG HVM |
| Back-end process |
C4
bump formation |
Bump
pitch |
Printing:150 (um)
u-ball:130 (um) |
Printing:150 (um)
u-ball:110 (um) |
| Bump
height (coin bump) |
10~30 (um) |
10~30 (um) |
| Bump
diameter (coin bump) |
25~150 (um) |
25~150 (um) |
| Bump
height (round bump) |
20~45/40~60 (um) |
20~45/40~60 (um) |
| New
material |
SAC305 HVM |
| SnCu0.7 HVM |
| New
process |
Paste printing
HVM |
| Micro-ball
process HVM |
| Plating bump
development |
| Structure |
Layer count |
Structure |
6/N/6 |
7/N/7 |
Green Material Set
| Category
|
Item |
Current |
2013 |
2014 |
| Q1 |
Q2 |
Q3 |
Q4 |
Q1 |
Q2 |
Q3 |
Q4 |
| Material |
Core |
NPG180I*/Hitachi
E679FGR, E700GR/Panasonic R1515SL,
R1515A, R1515W
MGC HL832NSF |
R1515* E705G/
E705G(LH) |
Ultra low CTE
core |
| Plugging
ink |
SP-08/SP-10/PHP900 IR6/Taiyo THP100 DX1 |
THP100 DX7
PHP900 IR6P
NY LV-01
NY HG-01 |
THP100
DX7
PHP900 IR10F |
| Dielectric |
GX-13/GX-92 |
GX92 , T31 |
Low loss/Low
CTE |
| SR |
SR-7200G/SR-7300G/AUS-703 |
AUS-G2 , SR-1 |
SR7400 |
| ASF |
I-tin/ENIG/ENEPIG/HG/OSP/E-Ni/Au |
New |
| Bumping |
SAC305/SC07/SA |
- |
Plated
bump |
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