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 Home > Technology > IC Substrate > Flip Chip Substrate Technology Roadmap
 
   
PCB
IC Substrate 

Flip Chip Substrate   
     Technology Roadmap 
   
SIP/CSP Substrate  
     Technology Roadmap 
 

 

Flip Chip Substrate Technology Roadmap
 

Products Roadmap/ Development Schedule 
 
Process Item Current Capability 2014 2015
H1 H2 H1 H2
Core Substrate Process Core Core Thickness 250um 200um 150um 100um
PTH Through Pitch 250um 200um 200um 175um
PTH/Land MTH:150/300 (um) MTH:100/250 (um)
LTH:90/175 (um)
MTH:100/200 (um)
LTH:80/160 (um)
MTH:75/175
LTH:80/150
Line/Space (Subtractive) 35/35 (um) by
18um Cu Thk 
30/30 (um) by 15um Cu Thk 25/25 (um) by 12um Cu Thk
Build-up Process Laser Via/Pad 60/90 (um) 60/90 (um) 60/85 (um) 55/80 (um)
Via Registration +/-15um +/-15um +/-12.5um +/-12.5um
Stack Via 4 Stacked Vias 4 Stacked Vias 5 Stacked Vias
DFR Formation Line/Space 9/12 (um) 9/12 (um) 10/10 (um) 8/8 (um)
Solder Resist Process SR Thickness 21um 21um 18um 18um
Tolerance +/-7.5um +/-7.5um +/-6um +/-5um
Registration +/-12.5um +/-10um +/-10um +/-8um
SRO 70um 65um 65um 60um
Surface Finish Lead Application Immersion Tin
ENIG
Lead Free
Application
Immersion Tin
ENEPIG
OSP
LGA Application ENAG/ENEPIG
C4 Bump Formation Bump Pitch Printing:140um
u-ball:130um
Printing:140um
u-ball:130um
Printing:130um
u-ball:100um
Printing:120um
u-ball:90um
Bump Height
(Coin Bump)
10~30 (um) 10~30 (um) 5~30 (um) 5~30 (um)
Bump Diameter
(Coin Bump)
25~130 (um) 25~130 (um) 25~120 (um) 25~115 (um)
Bump Height
(Round Bump)
20~45/40~60 (um) 20~45/40~60 (um) 20~40/25~45 (um) 20~40/25~40 (um)
New Material SAC305
SnCu0.7
New Process Paste Printing
Micro-ball Process
Plating Bump & Bump on Trace (BOT)
Structure Layer Count Structure 6/2/6 6/N/6 7/N/7

 

Green Material Set 
 
Category  Item Current Capability 2014 2015
H1 H2 H1 H2
Material Core NPG180I*Hitachi, E679FGR, E700GR, E705G
Panasonic R1515SL, R1515A, R1515W,
MGC HL832NSF
R1515G,
E705G/E705G(LH),
E770G, HL832NSI, HL832NSFLCA
Ultra Low CTE Core
Plugging Ink SP-08/SP-10/PHP900 IR6/Taiyo THP100 DX1 THP100 DX7 Ultra Low CTE Material
PHP-900 IR6P
PHP-900 IR-10F
Dielectric GX-13/GX-92/GX-T31 GZ41/NX04H Low Loss/Low CTE Material
SR SR-7200G/SR-7300G/AUS-703/SR-7210/AUS-320/ AUS-410 AUS-G2/SR-1/SR-F SR-FA/SR-2
ASF I-tin/ENIG/ENEPIG/HG/OSP/
E-Ni/Au
New
Bumping SAC305/SC07/SA - Plated Bump
 

  Updated Date: 2014/7/1