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Wire Bond Substrate Introduction & Application |
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 Product Outlines
By using gold wires to connect the chip and electrical
pads from the substrate, the substrate is known as "Wire Bond Substrate".
It plays the function as the buffer between the chip and PCB. By taking
the advantage of substrates, the ability of logic gate could fan out the most
inputs to the other logic gate efficiently.
Types of Package
 Ball Grid Array (BGA)
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Plastic BGA (PBGA)
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Chip Scale Package (CSP)
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Wire Bonding CSP
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Flip Chip CSP (FC-CSP)
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Window BGA
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Product Applications
| BGA： |
MCP, Southbridge Chipset,Communication, Networking |
| CSP： |
Memory (DRAM, Flash), Portable Device, Handset, Consumer
Electronics, PC Peripheral Device |
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Update Date:
2011/12/27 |
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