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 Home > Products & Applications > IC Substrate> Wire Bond Substrate Introduction & Application
 
   
 
PCB 
IC Substrate 
Flip Chip Substrate
Wire Bond Substrate
Development

 

   

Wire Bond Substrate Introduction & Application  
   
 

Product Outlines 
 
By using gold wires to connect the chip and electrical pads from the substrate, the substrate is known as "Wire Bond Substrate". It plays the function as the buffer between the chip and PCB. By taking the advantage of substrates, the ability of logic gate could fan out the most inputs to the other logic gate efficiently.

 
 
 
 
Types of Package
 
Ball Grid Array (BGA)
 

Plastic BGA (PBGA)


Chip Scale Package (CSP)
 

Wire Bonding CSP

Flip Chip CSP (FC-CSP)

Window BGA

 
Product Applications
 
BGA: MCP, Southbridge Chipset,Communication, Networking
CSP: Memory (DRAM, Flash), Portable Device, Handset, Consumer Electronics, PC Peripheral Device
 
 
    Updated Date: 2018/12/31