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 Home > Products & Applications > PCB > Development
 
   
PCB
Introduction & Application
Development
IC Substrate 

 

 

 

Development

In response to the evolution in the wafer manufacturing technology, there are growing requirements in the high-density 
circuits, transmission efficiency, and signals disturbing resistance. Thus, the trend of circuit on HDI boards and Rigid-
flex boards will tend to be high density stacked via, smaller via, and fine pitch solutions.
The application and types of HDI boards and Rigid-flex boards will be increasing, in order to be complied with the
features of future electronic products, which are ultra thin, multi-functional, and low voltage consuming.
 
The increasing environmental awareness propels electronic components and their material to be lead-free and halogen-
free, in order to become qualified green products defined by RoHS legislations.
Updated Date: 2018/12/31