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 Home > Products & Applications > IC Substrate> Flip Chip Substrate Introduction & Application
 
   
 
PCB 
IC Substrate 
Flip Chip Substrate
Wire Bond Substrate
Development

 

   

Flip Chip Substrate Introduction & Application  
   
 

Product Outlines 
 
The die is directly attached to the substrate which plays as the connection between the chip and PCB by using solder bumps rather than gold wires. By taking the advantage of substrates, the ability of logic gate could fan out the most inputs to the other logic gate efficiently. Meanwhile, the different ways of packaging improve I/O ports on flip chip substrates, which would be the developing trend in the future.

 
 
 
Types of Package
 

Pin Grid Array (PGA)

Land Grid Array (LGA)

Ball Grid Array (BGA)

 
 
Product Applications
 

Pin / Land Grid Array

Microprocessor

Ball Grid Array

Graphic Microprocessor, Northbridge Chipset, High-end ASIC Chipset, Set-top Box Chipset
 

 
    Updated Date: 2014/4/1