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 Home > Products & Applications > IC Substrate> Development
 
   
 
PCB 
IC Substrate 
Flip Chip Substrate
Wire Bond Substrate
Development

 

   

Development  
   
 

 

To follow the evolution in the wafer manufacturing, there are growing requirements in the high-density circuits, transmission efficiency, and signal disturbing resistance. Because of limited packaging technologies in wire bonding, the flip chip becomes the future main stream of IC substrates with the edge of solder ball planting.
As electronic devices are minimized in size while maintaining high efficient and low voltage consuming, the packaging method of flip chips shifts to multi-chip packaging from single-chip packaging.
ØThe wire bond is gradually replaced by the flip chip, and the layout will move to thin core, fine line, and fine pitch designs.
Along with the increasing needs in processing speed and high I/O, flip chip substrate packaging will move toward to the fine bump pitch packaging. In order to achieve UBM copper pillar packaging, the BOT design will be one of options. Also, 3D packaging will be the next generation for meeting the requirements of the fine bump density and high rigid substrate.
We will continue to develop high layer count(>22L) & LFF(>100mmSQ) substrate to meet customer’s 5G, AI, and HPC(High Performance Computing) applications.
 
    Updated Date: 2018/12/31