|
Item |
Current capability
|
2011 |
2012 |
|
Q3 |
Q4 |
Q1 |
Q2 |
Q3
|
Q4
|
|
Layer count &thickness, size
|
Maximum working panel size |
18x24 inch |
18x24 inch |
| Range of Layer count |
2~26 layers |
2~28 layers |
| Maximum thickness |
210 mil |
210 mil |
250 mil |
| Minimum thickness(4 layers) |
10 mil |
10 mil |
|
Line/space capability |
Line/space(1/2 oz) |
2/2 mil |
2/2 mil |
1.6/1.6
mil
|
|
Line/space(1 oz) |
2/2 mil |
2/2 mil |
1.6/1.6
mil
|
|
Line/space(2 oz) |
5/5 mil |
5/5 mil |
|
Line/space(3 oz) |
8/8
mil
|
8/8 mil |
| Line/space(5 oz)
|
12/12 mil |
12/12 mil |
|
S/M process |
Registration |
0.8 mil |
0.8 mil |
|
Solder dam minimum width |
2.5 mil |
2.5 mil |
2 mil |
|
Black S/M minimum dam width |
3.5 mil |
3.5 mil |
3 mil |
|
Impedance tolerance |
Single ended (50 ohm) |
+/-8% |
8% |
6% |
|
Differential pair(100 ohm) |
+/-10% |
10% |
8% |
| Routing
|
|
3 mil |
3 mil |
2 mil
|
|
Depth control accuracy |
+/-
2mil
|
2 mil
|
|
Mechanical drilling |
Smallest drilling hole size |
4 mil |
4 mil |
|
Smallest plated hole size |
3 mil |
3 mil |
|
Aspect ratio (PCB thickness / drilling hole size)
|
12.6 mil |
13 mil |
14 mil |
|
Internal/external via pad size (4 layers, 8 mil drilling size) |
14 mil |
14 mil |
12 mil |
|
Anti-pad size (4 layers,8 mil drilling size) |
22 mil |
20 mil |
18 mil |
|
Internal/external via pad size (6~12 layers, 10 mil drilling) |
18 mil |
18 mil |
16 mil |
|
Internal/external via pad size (12~26 layers, 12 mil drilling) |
22 mil |
22 mil |
20 mil |
| Back drilling
depth accuracy tolerance
|
+/-5 mil
|
+/-5
|
VIPPPO
structure
(Plugging hole aspect ratio)
|
12 mil
|
12 mil
|