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 首頁 > 技術專區 > PCB>  Standard PCB Technology Roadmap
 
   
PCB
PCB HLC Technology
      Roadmap
 HDI Technology Roadmap
IC Substrate

     

    

PCB HLC Technology Roadmap

Products Roadmap/ Development Schedule 
 

Category Item Current Capability By 2021 H2 By 2022 H1 By 2022 H2
Structure   Max. Layer Count 24 30 32 32
Max. Sequential
Lamination
8+8 8+8 10+10 10+10
Max. Thickness 3.2 mm 3.4 mm 3.6 mm 3.6 mm
Routing
Density 
Line Width/Space 1oz Cu 60/60 µm 60/60 µm 55/55 µm 55/55 µm
2oz Cu 115/115 µm 115/115 µm 100/100 µm 100/100 µm
Material High Tg, Low CTE, Low Dk/Df, Halogen Free

更新日期: 2021/10/5