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 首頁 > 技術專區 > PCB>  Rigid-Flex Technology Roadmap
 
   
 
PCB
Standard PCB Technology
     Roadmap
HDI Technology Roadmap
Rigid-Flex Technology
     Roadmap

PCB Material Technology
     Roadmap
IC Substrate

   

Rigid-Flex Technology Roadmap  
 
 

Item

Current capability

2010 2011
Q3 Q4 Q1 Q2 Q3 Q4
Structure Rigid-Flex symmetric structure N-2-N
N-4-N
N-2-N
N-4-N
Rigid-Flex with flying tail(asymmetrical structure) N-2 N-2
Rigid Flex HDI structure 2+N+2 2+N+2(stacked via)
Material thickness & resin flow FCCL Thickness 1 mil 1 mil
Minimum Coyerlay thickness(PI& adhesion) 1.1 mil
(0.6+0.5)
1.1 mil
Maximum Stffner thickness(PI& adhesion) 3 mil
(2+1)
4 mil
Minimum low flow pp thickness 1.6 mil 1.4 mil
LF PP squeeze out 28 mil 28 mil 28 mil
Via on FCCL Minimum mechanical drilling size 4 mil 4 mil
Minimum laser drilling size 4 mil 4 mil 3 mil
Line/space Line/space on FCCL 3/3 mil 2.4/2.4 mil 2/2 mil
Registration Coyerlay registration +/-8 mil +/-6 mil +/-4 mil
Router Router tolerance +/-2.4mil +/-2.4 mil +/-2 mil