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 首頁 > 技術專區 > PCB>  PCB Material Technology Roadmap
 
   
 
PCB
Standard PCB Technology
     Roadmap
HDI Technology Roadmap
Rigid-Flex Technology
     Roadmap

PCB Material Technology
     Roadmap
IC Substrate

   

PCB Material Technology Roadmap  
 
 

Item

Current capability

2010 2011
Q3 Q4 Q1 Q2

Q3

Q4

Copper Range of available copper weight (UL approved)
1/2~3oz
 
1/4~3oz
Thickness Core thickness range 2~47mil 1.6~47mil
PP thickness range 2~8mil 1.6~8mil
 Surface finish .Immersion sliver
.Immersion Ni/Auf
.Selective Ni/Au
.Hard Au
.OSP
.Immersion Tin
.Lead free HASL
  Non Halogen-Free Halogen Free
Material Rigid PCB material

NP140,155,170,175,180,RCC
Rogers4350,4403 (low Dk/Df)
Isola: 370HR, FR408, IS415

NPG-150,170, NPGN-150,170, RCC
Hitachi LZ71(low Dk)
S/M material

Taiyo PSR4000

Tamura DS330
Taiyo BL-02
Plugging hole material

Taiyo S702K

Taiyo THP100-DRT
Nanya SP-08
Flex PCB material

None

NPGLF
UBE
EMI shielding material

None

Toyobo: DW-250
Tasuta: SF-PC5000