|
Item
|
Current capability
|
2011 |
2012
|
|
Q3 |
Q4 |
Q1 |
Q2 |
Q3 |
Q4 |
|
Structure
|
HDI stagger via
|
5+N+5 |
5+N+5 |
6+N+6 |
| HDI stacked via
|
5 stacked |
5 stacked |
6 stacked
|
| HDI all stacked via
|
12 layers |
12 layers |
|
Laser via
|
Standard via
finished hole size
|
3 mil |
3 mil |
2.4 mil |
|
Standard via capture/target pad
|
6 mil |
6 mil |
4.3 mil |
|
Skip via finished hole size
|
8 mil |
8 mil |
| Skip via anti pad
|
22 mil |
22 mil |
| Skip via capture/target pad
|
16 mil |
16 mil |
| Step via finished hole size |
8 mil |
8 mil |
| Step via 2nd layer
pad
|
16 mil |
16 mil |
| Step via capture/target pad
|
16 mil |
16 mil |
| Laser via aspect
ratio (drilling size/thickness) |
0.75 mil |
0.75 mil |
| Copper filled dimple size |
0.6 mil |
0.6 mil |
| Laser drilling method |
DLD |
Direct laser drill |
| BGA pitch |
0.2 mm |
0.2 mm |
|
Embedded |
Embedded passives |
Sample |
Sample |
SVM |