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Flip Chip Substrate Technology
Roadmap |
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 Products Roadmap/
Development Schedule
| Process |
Item |
Development
schedule |
| 2010 |
2011 |
| Q1 |
Q2 |
Q3 |
Q4 |
Q1 |
Q2 |
Q3 |
Q4 |
| Core
substrate process |
Core |
Core thickness |
0.2mm |
0.2mm |
| PTH
drill |
Through pitch |
225(um) |
225(um) |
| Through diameter |
75(um) |
75(um) |
| DES |
Line / Spece |
35/35(um) |
30/30(um) |
| Build
up process |
Laser |
Via / Pad |
60/90(um) |
55/80(um) |
| Via registration |
15(um) |
12.5(um) |
| Stack via |
4 stacked vias |
5 stacked vias |
| DFR formation |
Line / Spece |
9/12(um) |
8/8(um) |
| Solder
resist process |
SR |
Thickness |
21+/-7.5(um) |
21+/-7.5(um) |
| Tolerance |
+/-7.5(um) |
+/-5(um) |
| Registration |
+/-12.5(um) |
+/-10(um) |
| SRO |
70(um) |
65(um) |
| Surface
finish |
Lead
application |
Immersion Tin
HVM |
| ENIG HVM |
| Lead free
application |
Immersion Tin
HVM |
| ENEPIG HVM |
| LGA application |
ENAG HVM |
| Back
end process |
C4
bump formation |
Bump pitch |
150(um) |
130(um) |
| Bump height (coin bump) |
10~30(um) |
10~30(um) |
| Bump diameter (coin bump) |
30~150(um) |
30~150(um) |
| Bump height (Round bump) |
20~45 / 40~60(um) |
20~45 / 40~60(um) |
| New material |
SAC305 HVM |
| SnCu HVM |
| New method |
Paste printing
HVM |
| Micro-ball
process HVM |
| Plating bump |
| Structure |
Layer
count |
Structure |
6/2/6 |
7/2/7 |
| 6/4/6 |
7/4/7 |
Green Material Set
| Category
|
Item |
Current |
2010 |
2011 |
| Q1 |
Q2 |
Q3 |
Q4 |
Q1 |
Q2 |
Q3 |
Q4 |
| Material |
Core |
NPG gen. / Hitachi E679 gen. / R1515
gen. |
Done |
| Plugging
ink |
SP-08/SP-10 |
Done |
| Dielectric |
GX-13 |
Done |
| SR |
SR-7200G/AUS-703 |
Done |
| ASF |
I-Ag/I-Tin / ENIG / ENEPIG / HG |
Done |
| Bumping |
SAC305 /SC07 / SA |
Done |
| DSC pre-soldering |
SAC305 / SC07 / SA |
Done |
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