Item	Current capability		2012				2013
			Q1	Q2	Q3	Q4	Q1	Q2
Layer count &thickness, size	Maximum working panel size	18x24 inch	18x24 inch
	Range of Layer count	2~26 layers	2~28 layers				2~30 layers
	Maximum thickness	210 mil	210 mil
	Minimum thickness(6 layers)	10 mil	10 mil
Line/space capability	Line/space(1/2 oz)	2/2 mil	2/2 mil
	Line/space(1 oz)	1.6/1.6 mil	1.6/1.6 mil
	Line/space(2 oz)	5/5 mil	5/5 mil
	Line/space(3 oz)	8/8 mil	8/8 mil
	Line/space(5 oz)	12/12 mil	12/12 mil
S/M process	Registration	0.8 mil	0.8 mil
	Solder dam minimum width	2.5 mil	2.5 mil				2 mil
	Black S/M minimum dam width	3.5 mil	3.5 mil				3 mil
	S/M Opening size	4 mil	4 mil
Impedance tolerance	Single ended (50 ohm)	+/-8%	+/-8%				+/-6%
	Differential pair(100 ohm)	+/-10%	+/-10%				+/-8%
Routing	Dimension tolerance	2 mil	2 mil
	Depth control accuracy	+/- 2mil	+/- 2 mil
Mechanical drilling	Smallest drilling hole size (PCB thickness)	6 mil (40 mil)	6 mil (40 mil)
	Smallest plated hole size (PCB thickness)	4 mil (40 mil)	4 mil (40 mil)
	Aspect ratio (PCB thickness / drilling hole size)	12.6 mil (10/126)	13.5 mil (10/135)				14 mil (10/140)
	Internal/external via pad size (4 layers, 8 mil drilling size)	14 mil	14 mil				12 mil
	Anti-pad size (4 layers,8 mil drilling size)	22 mil	20 mil				18 mil
	Internal/external via pad size (6~12 layers, 10 mil drilling)	18 mil	18 mil				16 mil
	Internal/external via pad size (12~26 layers, 12 mil drilling)	22 mil	22 mil				20 mil
	Back drilling depth accuracy tolerance	+/-5 mil	+/-5
	VIPPPO structure (Drilling hole/PCB thickness)	9 mil(11/96)	12.6 mil (10/126)